Adhesives / Encapsulants for Electronics and Semiconductor
ADHESIVE TECHNOLOGIES
Semiconductor Packaging Innovative Materials for Evolutionary Electronics Capability
Semiconductor technology and, specifically, the packaging of semiconductor devices has never touched more applications than it does today. As all parts of everyday life become increasingly digitalized – from automobiles to home security to smartphones and 5G infrastructure – semiconductor packaging innovation is at the core of responsive, reliable, robust electronic functionality.
Die Attach Film Adhesives
Die attach film adhesives are used for specific electronic manufacturing applications since they are easier to apply in a uniformed fashion across a substrate. With advances in electronic devices requiring smaller and high-performing materials, there is a growing need for die attach film adhesives that both are thin and quick curing as well as applied easily in small spaces. Henkel’s die attach film adhesives are up to the challenges for leadframe and wirebond semiconductor packaging in the electronics industry.
Wafer Backside Coating
Die Attach: Printable B stage
Printable die attach materials provide a viable alternative to standard die attach paste processes, allowing the application of adhesive at the wafer-level.
Encapsulants
Encapsulation materials for the effective protection of circuit boards and circuit board components
Function of Encapsulation:
•Primary Protection to Environment of Semiconductor Chip attach by Die Attach Adhesives to substrate.
•Facilitate Handling of the Wire Bonded Part without Damaging the Interconnections.
